Optical And electron microscopy were used to review the soldered unit, the place cracks were being discovered at the sides from the SMD transformer. Cross-sectional Assessment also exhibited vacant spaces round the cracks, i.e., they may perhaps have already been at the center of structural weak spot. 设计的规范度、细致度，直接决定产品的稳定性、寿命、量产良率�?掌握从原理图到 Contempla... https://www.jiadi-newmaterials.com/news/pcb-potting-compound-selection-guide.html